DIASEMI Ultra-Thin AlN Insulated Diamond–Copper Heat Spreader

 

DIASEMI Ultra-Thin AlN Insulated Diamond–Copper Heat Spreader

DIASEMI presents an advanced diamond–copper composite heat spreader featuring an ultra-thin aluminum nitride (AlN) ceramic coating (1–2 μm) for high-performance thermal management with electrical insulation.

Unlike conventional thick ceramic layers, the sub-micron AlN coating is deposited via precision thin-film processes, dramatically reducing thermal resistance while maintaining excellent dielectric strength and interface reliability.

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Key Features

• Ultra-thin AlN insulation: 1–2 μm (minimized thermal barrier)
• Exceptional thermal conductivity: up to 600–900 W/m·K (composite core)
• High dielectric strength: suitable for power electronics isolation
• Low thermal resistance interface: optimized for high heat flux devices
• Robust adhesion: engineered interfacial layer for long-term stability
• CTE matching: tailored for GaN, SiC, and advanced semiconductor packages

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Performance Advantage

By reducing the ceramic coating thickness from conventional tens of microns to 1–2 μm, DIASEMI achieves:

• >30–50% reduction in interfacial thermal resistance
• Improved heat dissipation efficiency under >1 kW/cm² heat flux
• Enhanced reliability under thermal cycling

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Applications

• GaN / SiC power modules
• High-power laser diode packages
• RF and microwave systems
• AI and high-density computing hardware

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Positioning

The DIASEMI solution bridges the gap between high thermal conductivity materials and electrical insulation, enabling next-generation compact, high-power semiconductor systems where both heat removal and dielectric isolation are critical.