DIASEMI™ TC4 / Diamond Composite

High-Performance Titanium Matrix Composite for Extreme Environments

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1. Product Overview

DIASEMI™ TC4/Diamond Composite is an advanced titanium matrix composite engineered by integrating TC4 titanium alloy with high-purity diamond particles. The material is consolidated via spark plasma sintering and can be further functionalized with chemical vapor deposition.

This hybrid architecture delivers a unique combination of:

• High strength-to-weight ratio
• Exceptional hardness and wear resistance
• Tunable thermal expansion
• Enhanced thermal management capability

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2. Key Features

• Diamond Reinforcement
  Improves hardness, wear resistance, and thermal conductivity
• Engineered Interface (TiC Layer)
  In-situ formation of TiC enhances bonding and load transfer
• CTE Matching Capability
  Adjustable coefficient of thermal expansion for system integration
• CVD-Compatible Surface
  Direct growth of diamond films for extreme surface performance
• Enhanced Densification (Optional Cu Phase)
  Improved consolidation without compromising microstructure

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3. Typical Properties

4. Microstructure Description

The composite consists of:

• TC4 matrix (continuous phase)
• Dispersed diamond particles
• Interfacial TiC transition layer

Functional Mechanism:

• Diamond → load bearing + thermal conduction
• TiC → interfacial bonding + stress transfer
• TC4 → structural integrity

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5. Surface Engineering Option

CVD Diamond Coating Capability

• Continuous diamond film achievable after ~4 hours deposition
• Strong adhesion via TiC interlayer
• Uniform morphology with optimized filament tension

Performance Enhancement:

• Ultra-low friction coefficient
• Extreme wear resistance
• Improved thermal flux handling

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6. Manufacturing Process

Step 1 – Powder Preparation

• TC4 powder + diamond powder
• High-energy ball milling for uniform mixing

Step 2 – Consolidation

• Spark plasma sintering (SPS)
• Controlled temperature, pressure, and dwell time

Step 3 – Surface Functionalization (Optional)

• Hot filament CVD diamond deposition
• Stress-controlled filament alignment

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7. Design Flexibility

8. Applications

 Aerospace

• Lightweight wear-resistant components
• Thermal-structural parts

Semiconductor Equipment

• Precision handling components
• Vacuum-compatible structures

 Tribology

• Bearings and sliding interfaces
• High-load wear systems

 Biomedical

• Biocompatible implants
• Surgical tools

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9. Competitive Advantages

• Integrated bulk + surface engineering
• Strong interfacial bonding via TiC
• Scalable SPS + CVD manufacturing
• Tunable thermal and mechanical properties

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10. Customization Options

DIASEMI provides:

• Diamond particle size & fraction tuning
• Custom geometry (plates, discs, complex shapes)
• Surface coating (thickness, roughness, grain size)
• Hybrid structures (Cu-enhanced densification)

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11. Ordering Information

Code	Description
DIA-TD-10	10% Diamond Composite
DIA-TD-20	20% Diamond Composite
DIA-TD-CVD	With CVD Diamond Coating
DIA-TD-CU	Cu-enhanced densification

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12. Quality & Testing

• SEM microstructure analysis
• Raman spectroscopy (diamond quality)
• Density & porosity measurement
• Hardness and mechanical testing
• Thermal expansion & conductivity characterization

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13. Disclaimer

Values shown are typical and may vary depending on processing conditions and customization. DIASEMI recommends application-specific validation.