Cleaning Material for Wafer Chuck Table Cleaning
Wafer®
The
Cleaning Wafer is for removing small particles on the robot arms or chuck
tables of semiconductor-manufacturing equipment.
The Cleaning Wafer, having a
special cleaning layer, can remove small particles in the semiconductor
manufacturing equipment. Down-time of tools can be drastically reduced by using
the cleaning wafer, compared with the ordinal hand cleaning method. The
cleaning wafer can also be used for preventive maintenance so that yield
improvement can be expected.
Applications
·
Especially for vacuum chamber in semiconductor front-end process
where particle trouble happens.
·
All mid-end process of semiconductor manufacturing equipment.
·
Chuck table or stage which cannot be cleaned by hand.
