BDD

 

Aspect	Silicon-based BDD electrode	Nickel-based BDD electrode	Titanium-based BDD electrode
Substrate/interlayer	Heavily doped Si wafers, often with buffer/carbonized layer	Ni foils, meshes, or coatings	Ti plates/foils, often forming TiC/TiN interface
Adhesion of diamond film	Moderate; risk of delamination due to stress (Si/diamond mismatch)	Good; Ni ductility buffers stress, but Ni–C phases may weaken long-term adhesion	Excellent; Ti forms stable TiC/TiN interlayer ensuring strong bonding
Thermal expansion mismatch with diamond	High (leads to residual stress & cracks)	Lower mismatch than Si	Very low mismatch; best stress relief
Electrochemical window (vs. Ag/AgCl)	Wide (up to ~3.5 V)	Wide, but slightly narrower due to Ni interactions	Wide (similar to Si-BDD, ~3.5 V)
Corrosion/chemical stability	Si substrate prone to oxidation/corrosion under long-term anodic polarization	Ni corrodes in chloride-containing wastewater; Ni²⁺ release is problematic	Ti highly corrosion-resistant; TiC/TiN barrier protects substrate
Service lifetime in water treatment	Shorter (substrate degradation limits use)	Moderate (substrate corrosion limits durability)	Longest (excellent lifetime, often >10,000 h reported)
Pollutant degradation efficiency	High (due to strong •OH radical generation)	High, but can drop with Ni dissolution	High, very stable across repeated cycles
Cost & scalability	Lower cost (Si wafers), easy to microfabricate, but limited electrode area	Moderate cost, can be made in larger area (foils/meshes)	Higher cost, but robust and widely adopted for industrial water treatment
Typical applications in water treatment	Lab-scale reactors, sensors, fundamental studies of EAOP	Pilot-scale reactors, electro-Fenton processes, H₂O₂ electrogeneration	Full-scale industrial wastewater treatment, electrochemical oxidation of persistent organic pollutants (POPs)

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