DIASEMI DIAMOND COATED SiC WAFER
SPECS: Silicon Carbide and Diamond Composite Material
Dimension: Φ25.2mm
Global Thickness: 0.67-0.73mm
Center Thickness: 0.71mm
Silicon Carbide Thickness: 0.45mm
Diamond Thickness: 0.25mm
Thermal Conductivity:
Diamond side: 907.388 mm2 /s;
SiC side: 882.022 mm2/s
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