DGP8761 Fully Automatic Grinder/Polisher

DGP8761 Fully Automatic Grinder/Polisher

Porous ceramic chuck table by Cerameric/ Semixicon

 

9/12 inch ring can be modified per your unique needs

www.semixicon.com

High-efficiency grinder/polisher for Φ300 mm wafers

• Φ300 mm
• 3 axes, 4 chuck tables
• DBG
• SDBG
• Wafer Thinning
• Stress Releaf

Realizes improvements in process stability and higher throughput

The DGP8761 is the successor to the DGP8760, which is used by premier manufacturers worldwide. It integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm. The DGP8761 is equipped with a newly developed spindle to support high-speed grinding. This contributes to a shorter thin wafer processing time (compared to the DGP8760). In addition, an optimized handling layout shortens the cycle time (not including processing time).

Various Z3 spindle configurations

The following Z3 spindle configurations for thin wafer processing can be selected:

Stress relief

• Dry polishing - an environmentally friendly process without chemicals or water
• CMP (optional)

Super fine grinding (optional)

• Poligrind
• UltraPoligrind

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Realizing configurations which provide a gettering effect on the Z3-axis

*Gettering: a process which forms a minute destructive layer (gettering sites) inside the silicon wafer. Impurities, such as heavy metals, present in the wafer are captured at these gettering sites.

Gettering DP

This is a solution which realizes high die strength and maintains the gettering effect by using DISCO’s unique dry polishing.

Grinding wheel "UltraPoligrind"

The newly developed UltraPoligrind wheel, which uses micro-abrasives, can process thin wafers without chemicals. The wheel can achieve high wafer strength which cannot be obtained with traditional grinding wheels, while maintaining the grinding gettering effect (Extrinsic Gettering).

System expandability

By integrating the DGP8761 with a multi-wafer mounter, DFM2800, it is possible to support the attachment of DAF (Die Attach Film) for thin wafers. It can also be used in an inline configuration with DISCO's DBG (Dicing Before Grinding) process.

DISCO 8000 Series compatibility

The DGP8761 is compatible with grinding wheels, polishing wheels, dresser boards and other parts designed for existing DISCO 8000 Series equipment. In addition, the operation method and GUI (Graphical User Interface) are based on proven 8000 Series technology.

Work Flow System

1. The robot pick removes a wafer from the cassette and places it on the positioning table, where centering takes place.
2. The T1 arm places the wafer on the chuck table.
3. The wafer proceeds to Z1 for rough grinding.
4. The wafer proceeds to Z2 for fine grinding.
5. The wafer proceeds to Z3 for dry polishing (or ultra high-mesh wheel grinding).
6. The T2 arm removes the wafer from the chuck table and places it on the spinner table.
7. cleaning → drying
8. Transfer to the mounter (DFM2800) or the robot pick returns the workpiece to the cassette.
9.