Friday, February 3, 2017

Aluminum Nitride (AlN) Substrates Wafer

Aluminum Nitride (AlN) Substrates Wafer













Item
Unit
Type
AN-170
AN-200
 Dimension
inch
6"×6" (max)
2x2/4x4/6x6/8x8,12"×12" (max)
 Thickness
mm
0.385/0.635/1.0/1.2 
0.385 t 1.5
10.0 (max)
 Through hole
mm
φ0.1
φ0.1
Density
g/cm3
3.3-3.35
3.33-3.36

Thermal Conductivity
W/(m.k)
170-190
200






















www.chuck-table.com

No comments:

Post a Comment