Monday, December 1, 2025

《川の流れのように》(像河之流动)

《川の流れのように》(像河之流动)的歌词

知らず知らず 歩いて来た
细く长い この道
振り返れば 遥か远く
故郷が见える
でこぼこ道や 曲がりくねった道
地図さえない それもまた 人生
ああ 川の流れのように ゆるやかに
いくつも 时代は过ぎて
ああ 川の流れのように とめどなく
空が黄昏に 染まるだけ

生きることは 旅すること
终わりのない この道
爱する人 そばに连れて
梦探しながら 雨に降られて
ぬかるんだ道でも いつかは また
晴れる日が来るから
ああ 川の流れのように おだやかに
この身をまかせていたい
ああ 川の流れのように

移りゆく 季节 雪どけを待ちながら
ああ 川の流れのように おだやかに
この身をまかせていたい
ああ 川の流れのように
いつまでも 青いせせらぎを 闻きながら

中文翻译如下:

不知不觉 走到了这里
回头看看 这条细细长长的路
通向那远方的故乡
崎岖不平的路 弯弯曲曲的路
地图上也没有记载 宛若人的一生
啊 那河水 缓缓地 流经了世世代代
啊 那缓缓流淌的河水 毫不停息,流向远方
与天边的晚霞融为一体

生命如同旅行
在这条没有终点的路上
与相爱的人携手为伴
共同寻找梦想
就算大雨泥泞了道路
也总有放晴的一天
啊 那缓缓流动的河水 那么安详,那么平稳
让人想寄身其中
啊 就像那缓缓流动的河水

四季也在不停轮回 冰雪最终也会消融
啊 那缓缓流动的河水 那么安详,那么平稳
让人想寄身其中
啊 那缓缓流动的河水
那青绿的溪流声 无时无刻,总在耳畔回荡

Saturday, November 29, 2025

CERAMERIC AlON Transparent Ceramics

 

CERAMERIC AlON Transparent Ceramics

www.cerameric.com

Clear. Strong. Built for Extreme Environments.

Aluminum Oxynitride (AlON) from CERAMERIC delivers a unique combination of optical clarity, structural strength, and environmental durability. It is engineered for applications where conventional glass or oxide ceramics cannot survive.


Key Advantages

  • Wide spectral transmission: 0.2–6.0 μm (UV–Mid IR)

  • High strength & hardness for impact and abrasion resistance

  • Lightweight ballistic capability

  • Thermal-shock and chemical stability

  • Excellent polishability for optical surfaces

AlON maintains performance under high stress, high temperature, and high-speed aerodynamic conditions.


Applications

Defense

  • Transparent armor

  • Missile domes

  • Seeker and sensor windows

Aerospace

  • High-speed optical windows

  • Environmental sensor housings

Industrial

  • IR imaging components

  • Scanner and inspection windows

  • High-temperature viewing ports


CERAMERIC Manufacturing Capabilities

  • High-purity AlON powder engineering

  • Reaction sintered and premium optical-grade processes

  • Precision shaping: domes, plates, custom geometries

  • Optical-grade finishing and coating options

Our dual-process approach allows us to offer both cost-effective structural grades and high-transparency optical grades.


Why CERAMERIC

  • Reliable scaling from prototypes to production

  • Consistent microstructure and transmittance

  • Engineering support for demanding environments


Build your next-generation optical protection with CERAMERIC AlON.

Contact us for samples or technical support.

www.cerameric.com

Transparent β-Si₃N₄ Ceramics

Transparent β-Si₃N₄ Ceramics

The below articles is from 

www.cerameric.com

Over the past two decades, transparent ceramics have advanced rapidly, with materials such as sapphire, MgAl₂O₄ spinel, and AlON achieving broad adoption in optical windows, protection systems, and laser components. However, these conventional transparent oxides exhibit inherent limitations in mechanical strength, thermal-shock resistance, and high-temperature stability. As a result, they cannot fully satisfy the requirements of extreme-environment optical systems, hypersonic platforms, or next-generation transparent armor.

In this context, transparent β-Si₃N₄ (silicon nitride) has emerged as a promising frontier material. Si₃N₄ is a well-known structural ceramic with high strength, high fracture toughness, excellent thermal-shock resistance, oxidation resistance, and chemical stability. Conventional Si₃N₄ is dark and opaque, primarily due to glassy intergranular phases, residual porosity, refractive-index mismatch, and uneven grain size–induced scattering.

Achieving optical transparency requires extreme control of the ceramic microstructure: full densification, clean and refractive-index-matched grain boundaries, uniform grain size, and suppression of abnormal growth. Additionally, transparent ceramics strongly prefer the hexagonal β-Si₃N₄ phase, which provides superior stability and mechanical performance.

Key Technical Challenges

The fabrication of optically transparent Si₃N₄ is exceptionally difficult and is driven by three major challenges:

1. Powder Purity and Oxygen Removal

Si₃N₄ powders naturally form a SiO₂ surface layer that produces glassy grain-boundary phases during sintering, leading to strong scattering. Removing or minimizing this oxide layer requires chemical etching, reductive annealing, and high-purity powder synthesis.

2. Densification Without Oxide Additives

Conventional Si₃N₄ densification relies on oxide additives to form a liquid phase, but these additives degrade transparency. Therefore, transparent Si₃N₄ typically requires:

  • HPHT (high-pressure, high-temperature) sintering,

  • near-zero sintering additives,

  • solid-state densification assisted by multi-GPa pressure,
    ensuring pore-free structure and clean grain boundaries.

3. Controlled α→β Phase Transformation

High transparency requires complete β-phase formation while avoiding abnormal grain growth and columnar grains, which increase scattering. This is achieved by:

  • using small amounts of β-Si₃N₄ seed particles,

  • tailoring phase-transformation kinetics,

  • applying short high-temperature dwell times.

These combined constraints make transparent β-Si₃N₄ one of the most challenging transparent ceramic systems known today.


Performance Advantages and Application Potential

Transparent β-Si₃N₄ offers a unique combination of structural and optical functionality. Compared with oxide-based transparent ceramics, it delivers:

  • Higher mechanical strength and fracture toughness

  • Superior thermal-shock resistance

  • Excellent high-temperature mechanical retention

  • Lower density relative to sapphire

These attributes enable applications that oxides cannot fully support.

Key Application Domains

1. Extreme-Environment Optical Windows
Suitable for hypersonic vehicle radomes, seeker domes, combustion-chamber windows, and reactor observation ports due to its high-temperature strength and oxidation resistance.

2. Transparent Armor and Protective Systems
Its high strength–to-weight ratio enables thickness reduction and weight savings in multilayer transparent armor stacks, partly replacing sapphire or spinel.

3. High-Power Laser Windows and Optics
Higher thermal conductivity and fracture resistance reduce thermal-lensing effects under high-energy beams.

Across all scenarios, transparent β-Si₃N₄ targets applications where simultaneous optical transmission, high strength, and high-temperature stability are mandatory — a performance space not fully covered by current oxide ceramics.

www.cerameric.com

Friday, November 21, 2025

Nano Polycrystalline Diamond --- SiC GaN semiconductor industry Diasemi

Nano Polycrystalline Diamond --- SiC GaN semiconductor industry Diasemi

With the rapid advancement of advanced manufacturing and new materials technologies, micro-/Nano Polycrystalline Diamond has become indispensable in precision polishing, ultra-precision machining, functional coatings, and high-end slurry formulations due to its extreme hardness, high specific surface area, and tunable surface chemistry. The accelerated expansion of third-generation semiconductors such as SiC and GaN is further driving the demand for high-purity, highly dispersible, and size-controlled micro-/materials.

Although detonation synthesis remains the most scalable and cost-effective route for producing micro-/Nano Polycrystalline Diamond, it faces persistent bottlenecks—including broad particle-size distributions, low graphite-to-diamond phase-transition efficiency, limited yield, and poor dispersion stability. These challenges represent both fundamental scientific issues and major engineering barriers to industrial adoption.

To address these limitations, Diasemi has developed a comprehensive technology framework for precision synthesis of detonation-derived micro-/nano-polycrystalline diamond:

  • Heterogeneous nucleation control, enabling narrow particle-size distribution;

  • Hollow-framework catalytic systems, significantly enhancing phase-transition efficiency and enabling high-yield carbon conversion to diamond;

  • Next-generation detonation engineering platforms, overcoming conventional yield constraints and enabling a daily capacity of 600,000 carats.

In parallel, Diasemi established a dual stabilization strategy—“micro-scale screening + mesoscopic freezing”—and developed proprietary monodisperse, fully suspended micro-/nano-polycrystalline diamond polishing slurries capable of long-term high-solids stability. These products have been successfully deployed in a top tier 6-8 inch SiCwafer manufacturing fabs, delivering reliable solutions for achieving angstrom-level surface flatness in ultra-precision SiC wafer finishing.

Diasemi’s innovations provide a robust materials foundation for next-generation semiconductor manufacturing and the broader high-end precision-processing industry.

www.diasemi.us



Thursday, November 13, 2025

Sarai (サライ) Song by Shinji Tanimura

 Sarai (サライ)


遠い夢すてきれずに 故郷(ふるさと)をすてた

穏やかな春の陽射しが ゆれる小さな駅舎(えき)別離(わかれ)より悲しみより 憧憬(あこがれ)はつよく淋しさと背中合わせの ひとりきりの旅立ち
動き始めた 汽車の窓辺を流れてゆく景色だけを じっと見ていたサクラ吹雪の サライの空は哀しい程青く澄んで 胸が震えた
恋をして恋に破れ 眠れずに過ごすアパートの窓ガラス越し 見てた夜空の星この街で夢追うなら もう少し強くならなけりゃ時の流れに 負けてしまいそうで
動き始めた 朝の街角人の群れに埋もれながら 空を見上げたサクラ吹雪の サライの空へ流れてゆく白い雲に 胸が震えた
離れれば離れる程 なおさらにつのるこの想い忘れられずに ひらく古いアルバム若い日の父と母に 包まれて過ぎたやわらかな日々の暮らしを なぞりながら生きるまぶたとじれば 浮かぶ景色が迷いながらいつか帰る 愛の故郷(ふるさと)
サクラ吹雪の サライの空へいつか帰るその時まで 夢はすてない
まぶたとじれば 浮かぶ景色が迷いながらいつか帰る 愛の故郷(ふるさと)サクラ吹雪の サライの空へいつか帰る いつか帰る きっと帰るから

Thursday, September 25, 2025

Y₂O₃ Coatings in Semiconductor Etching Equipment

 

Y₂O₃ Coatings in Semiconductor Etching Equipment

Yttrium oxide (Y₂O₃) coatings are widely applied to critical components in plasma etching chambers due to their outstanding resistance to plasma erosion, low particle generation, and ability to maintain process stability.

Key Benefits

  1. Plasma Erosion Resistance

    • In fluorine-based plasmas, Y₂O₃ forms stable compounds such as YF₃ and YOF.

    • These act as protective layers, resulting in extremely low etch rates (~11.5 nm/min).

    • Component lifetime is significantly extended, reducing replacement frequency.

  2. Contamination Reduction

    • High-purity Y₂O₃ is chemically stable and generates minimal particles.

    • This reduces wafer defects and improves product yield.

  3. Process Stability

    • Prevents chamber wall erosion and composition shifts, minimizing process drift.

    • Ensures high repeatability and consistency, boosting production efficiency.

  4. Extended Maintenance Cycles

    • Protects aluminum alloy substrates and enhances durability.

    • Extends overhaul intervals from ~15 days to 6 months or more.

Why Y₂O₃ Excels

  • Chemical Stability: Reaction byproducts (YF₃/YOF) are inert and protective.

  • Low Etch Rate: Dense coatings exhibit slow degradation in fluorocarbon plasmas.

  • Dense Microstructure: Low porosity prevents plasma penetration.

Fabrication Process

  • Surface Preparation: Substrates are grit-blasted for strong adhesion.

  • Powder Engineering: Spherical, spray-granulated Y₂O₃ powders enable uniform melting.

  • Plasma Spraying: APS or SPS techniques deposit molten particles under tightly controlled conditions.

  • Optimized Coatings: High density, low porosity, and strong adhesion are achieved.

Future Directions

Research is aimed at higher-density, higher-purity coatings, improved multi-gas plasma resistance, modified Y₂O₃ systems, and advanced spraying technologies for greater reliability in next-generation semiconductor manufacturing.

www.cerameric.com

BDD

 

AspectSilicon-based BDD electrodeNickel-based BDD electrodeTitanium-based BDD electrode
Substrate/interlayerHeavily doped Si wafers, often with buffer/carbonized layerNi foils, meshes, or coatingsTi plates/foils, often forming TiC/TiN interface
Adhesion of diamond filmModerate; risk of delamination due to stress (Si/diamond mismatch)Good; Ni ductility buffers stress, but Ni–C phases may weaken long-term adhesionExcellent; Ti forms stable TiC/TiN interlayer ensuring strong bonding
Thermal expansion mismatch with diamondHigh (leads to residual stress & cracks)Lower mismatch than SiVery low mismatch; best stress relief
Electrochemical window (vs. Ag/AgCl)Wide (up to ~3.5 V)Wide, but slightly narrower due to Ni interactionsWide (similar to Si-BDD, ~3.5 V)
Corrosion/chemical stabilitySi substrate prone to oxidation/corrosion under long-term anodic polarizationNi corrodes in chloride-containing wastewater; Ni²⁺ release is problematicTi highly corrosion-resistant; TiC/TiN barrier protects substrate
Service lifetime in water treatmentShorter (substrate degradation limits use)Moderate (substrate corrosion limits durability)Longest (excellent lifetime, often >10,000 h reported)
Pollutant degradation efficiencyHigh (due to strong •OH radical generation)High, but can drop with Ni dissolutionHigh, very stable across repeated cycles
Cost & scalabilityLower cost (Si wafers), easy to microfabricate, but limited electrode areaModerate cost, can be made in larger area (foils/meshes)Higher cost, but robust and widely adopted for industrial water treatment
Typical applications in water treatmentLab-scale reactors, sensors, fundamental studies of EAOPPilot-scale reactors, electro-Fenton processes, H₂O₂ electrogenerationFull-scale industrial wastewater treatment, electrochemical oxidation of persistent organic pollutants (POPs)