Thursday, April 12, 2018

AlN Substrate Aluminium Nitride Wafer









High thermal conductivity  AlN Ø100*1.0 wafer made by semiXicon

Type 1:

Dimension: 7.5"X5.5"X0.635mm+/-0.15

Thickness:0.635mm+/-0.05

Surface Roughness: 0.3-0.6

Thermal conductivity at 20 C: >180 W.M.K.

Type 2:

Dimension: 7.5"X5.5"X1.0mm+/-0.15

Thickness:1.0 mm+/-0.05

Surface Roughness: 0.3-0.6

Thermal conductivity at 20 C: >180 W.M.K.

Semitransparent


The semiXicon aluminum nitride (AlN) ceramic carries high thermal conductivity(5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,it goes with standard wafer sized such as 3,4,5,6,8

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