Semiconductor wafer back grinding chuck table
Friday, April 20, 2018
Thursday, April 12, 2018
AlN Substrate Aluminium Nitride Wafer
High thermal conductivity AlN Ø100*1.0 wafer made by semiXicon
Type 1:
Dimension: 7.5"X5.5"X0.635mm+/-0.15
Thickness:0.635mm+/-0.05
Surface Roughness: 0.3-0.6
Thermal conductivity at 20 C: >180 W.M.K.
Type 2:
Dimension: 7.5"X5.5"X1.0mm+/-0.15
Thickness:1.0 mm+/-0.05
Surface Roughness: 0.3-0.6
Thermal conductivity at 20 C: >180 W.M.K.
Semitransparent
The semiXicon aluminum nitride (AlN) ceramic carries high thermal conductivity(5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,it goes with standard wafer sized such as 3,4,5,6,8
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